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Luna Optoelectronics
PLASTIC ENCAPSULATED CERAMIC PKG, TO-18
PHOTODIODE, SOLDERABLE PLANAR; 0.3 MA (MIN.); 0.40 V (TYP.); 1.7 UA (MAX.)
Photodiode, Solderable Planar; 1.4 mA (Min.); 0.40 V (Typ.); 5 uA (Max.)
Photodiode, Planar; Clear Epoxy Dome Package; 700 muA (Typ.); 0.40 V (Typ.)
WAVELENGTH SELECTIVE PHOTODIODES, HERMETIC, CERAMIC, T0-5 CERAMIC
WAVELENGTH SELECTIVE PHOTODIODES, HERMETIC, CERAMIC, SMD PACKAGES
Photoconductive Cell; 150 Ohms (Typ.) @100 ftc; 1000 Kilohms (Min.); 690 nm
Photoconductive Cell, Hermetically Sealed, TO-8
Photo Diode, Planar; 1.2 mA (Typ.); 0.40 V (Typ.); 3.3 muA (Max.); 0.7 nF (Typ.)
PHOTOCONDUCTIVE CELL, TO-8P PKG, 250 VOLTAGE OHMS
Photodiode, Planar; TO-46; 70 muA (Typ.); 0.40 V (Typ.); 1 nA (Max.); -40 degC
WIREBONDERABLE PHOTODIODE CHIPS; 1.50 X1.50MM
Optoelectronics, Optocoupler; R(on) 0.90ohms, R(off) 500Kohms; V(f), 2.0V; I(f), 40mA;
Photodiode, Planar; Clear Epoxy Dome Package; 180 muA (Typ.); 0.40 V (Typ.); 2.0
Panel Mount Hermetic Sensor
Photodiode, Planar; TO-46; 450 muA (Typ.); 0.40 V (Typ.); 100 nA (Max.); -40 de
Photodiode; 7.5 uA (Min.); 0.40 V (Typ.); 100 nA (Max.); 40 pF (Typ.); -20 degC
Photocell; 20 M (Min.); 550 nm; 320 Vpeak (Max.); 125 mW @ 25 degC; TO-5; -60
WIREBONDERABLE PHOTODIODE CHIPS; 1.73 X1.73MM
6990034
Photoconductive Cell, Hermetically Sealed, TO-18
Photodiode, Planar; 130 muA (Typ.); 0.40 V (Typ.); 100 nA (Max.); 40 pF (Typ.)
WIREBONDERABLE PHOTODIODE CHIPS; 1.98 X1.98MM
panel mount hermetic, nm 560, a/w .37, nA 10, v 50
WIREBONDERABLE PHOTODIODE CHIPS; 3.6 X 3.6; MM
panele mount, open ceramic, 5 meg ohms, max 100v